MEMS倒装芯片组装的快速原型设计

Proceedings RAWCON 98. 1998 IEEE Radio and Wireless Conference (Cat. No.98EX194) Pub Date : 1998-08-09 DOI:10.1109/RAWCON.1998.709194

R. Irwin, Wenge Zhang, K. Harsh, Y.C. Lee

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引用次数: 28

摘要

本文描述了一种利用倒装芯片热超声键合将微机电系统(MEMS)器件转移到二次衬底的工艺。使用标准的线键合机在未释放的MEMS芯片上放置/spl sim/100-/spl mu/m的凸起。然后将凸起的芯片倒装到含有微波共面波导(CPW)的二次衬底上。粘合后，整个组件通过MEMS释放过程运行，之后移除MEMS主衬底。热超声键合是一种非常可靠的原型工具，具有100%的键合收率。该转移过程可用于任何可线键合的MEMS。该过程还可以应用于各种应用程序。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Quick prototyping of flip chip assembly with MEMS

This paper describes a process to transfer microelectromechanical systems (MEMS) devices to a secondary substrate using flip-chip thermosonic bonding. A standard wire-bonding machine was used to place /spl sim/100-/spl mu/m bumps on unreleased MEMS chiplets. The bumped chiplet was then flip-chip bonded to a secondary substrate containing a microwave coplanar waveguide (CPW). After bonding, the entire assembly was run through the MEMS release process, after which the MEMS host substrate was removed. The thermosonic bonding was a very reliable prototyping tool with a 100% bonding yield. The transfer process can be used with any MEMS that can be wire bonded. The process can also be applied to a variety of applications.

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来源期刊

Proceedings RAWCON 98. 1998 IEEE Radio and Wireless Conference (Cat. No.98EX194)

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