聚酰亚胺薄膜自愈击穿特性——环境气体对击穿特性的影响

Y. Muramoto, M. Nagao, M. Kosaki
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引用次数: 0

摘要

我们一直在研究聚酰亚胺(PI)薄膜的击穿特性,试图利用自愈击穿的优势。研究了环境气体(SF/sub - 6/、N/sub - 2/、O/sub - 2/和干燥空气)对PI薄膜击穿特性的影响。在室温下,SF/sub 6/中的电强度(Fb)高于其他气体。在施加电压极性反转后,干燥空气中的Fb显著下降,然后随着击穿次数的增加而逐渐增加。而SF/sub 6/和N/sub 2/的Fb在极性反转后基本保持不变。N/sub - 2/和O/sub - 2/混合气体中的Fb经过极性反转后下降,并随着氧浓度的增加而降低。这可能是由于环境气体影响PI薄膜中空间电荷的形成,由于它是多孔结构,因此可以考虑环境气体-PI薄膜复合体系击穿特性的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Self-healing breakdown characteristics of polyimide thin films-effect of ambient gas on breakdown characteristics
We have been studying the breakdown characteristics of polyimide (PI) thin films to try and take advantage of self-healing breakdown. This paper focuses on the effect of ambient gas (SF/sub 6/, N/sub 2/, O/sub 2/ and dry air) on breakdown characteristics of PI thin films. At room temperature, electric strength (Fb) in SF/sub 6/ is higher than in other gases. The Fb in dry air fell significantly just after the polarity reversal of the applied voltage and then gradually increased with the number of breakdowns. However, the Fb in SF/sub 6/ and N/sub 2/ retained nearly the same value after the polarity reversal. The Fb in the mixed gas of N/sub 2/ and O/sub 2/ fell after polarity reversal and decreased with increase of oxygen concentration. This is probably due to the fact that the ambient gas affects space-charge formation in PI thin films, Because it is a porous structure, the possibility of breakdown characteristics of ambient gas-PI thin film composite system may be taken into account.
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