低温共烧陶瓷衬底瞬态液相键合研究

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI:10.1109/iTherm54085.2022.9899666

John G. Harris, D. Huitink

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引用次数: 1

摘要

为了充分利用宽禁带半导体的高温潜力，本文在金低温共烧陶瓷导体上实现了瞬态液相烧结键。这些键的强度是通过260摄氏度的模具剪切测试来表征的。用两组样品来确定是否有好处，如果有的话，在铜、银、锡TLPS键合金LTCC油墨的过程中夹杂一层电镀铜。报道了各试件的抗剪强度和抗剪模量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Investigation of Transient Liquid Phase Bonding to Low Temperature Co-fired Ceramic Substrates

In an effort to capitalize on the high temperature potential of wide band gap semiconductors, this paper implements transient liquid phase sintering bonds on gold low temperature co-fired ceramic conductors. The strength of these bonds is characterized by die shear tests at 260 degrees Celsius. Two sample groups are used to determine the benefit, if any to the inclusion of an electroplated copper layer in the process of copper, silver, tin TLPS bonding on gold LTCC ink. The shear strength and shear modulus of each are reported.

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来源期刊

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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