采用体感技术控制工业检测模块

H. Yen, Guan-Lin Chen, Jui-Hsin Tsao
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引用次数: 1

摘要

近年来,消费类电子产品的轻、薄、短、小、多功能需求,推动SMT厂商使其IC封装元件尺寸不断缩小。为了提高微型封装元件的产量,许多制造商都在无尘室中生产和测试微型IC封装元件。本研究针对微小晶片封装(CSP)元件,开发一套基于kinect的检测系统。该系统采用Kinect传感器进行人体骨骼检测。通过我们开发的软件,洁净室外的操作人员可以运用体感技术,通过玻璃窗直接用手控制洁净室内的照明模块、平移模块等重要检测模块。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Control of industrial inspection modules using Kinect somatosensory technology
In recent years, the light, thin, short, small and multi-function demand of consumer electronic products has driven SMT manufactures to make their IC package component sizes continue to shrink. For improving production yields of the tiny package components, many manufacturers have produced and tested the tiny IC package components in a clean room. This study aims the tiny chip size package (CSP) components to develop a Kinect-based inspection system. The proposed system applied Kinect sensor to perform human skeleton detection. With our developed software, the operator outside the clean room can use his hand to directly control the important inspection modules such as lighting module and translation module, which are located in the clean room, through the glass window by applying somatosensory technology.
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