基于PCB和封装的处理器/存储系统的电磁兼容性能分析

2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2015-11-10 DOI:10.1109/EMCCOMPO.2015.7358364

E. Sicard, A. Boyer, P. Fernandez-Lopez, A. Zhou, N. Marier, F. Lafon

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引用次数: 3

摘要

本文研究了采用封装对封装(PoP)技术的片上系统(SoC)和堆叠存储器的信号完整性(SI)和电磁兼容性(EMC)性能。介绍了将IC-EMC软件平台重构为PoP的方法。基于IC-EMC软件平台进行的仿真和预测分析，从现有的使用离散65纳米SoC产品的2D组装，分析了使用下一代(NG) 28纳米堆叠存储器产品的PoP集成的好处。

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EMC performance analysis of a processor/memory system using PCB and Package-On-Package

In this paper, the signal integrity (SI) and Electromagnetic Compatibility (EMC) performance of System-On-Chip (SoC) and stacked memory using Package-On-Package (PoP) technology is investigated. The reconfiguration of the IC-EMC software platform to PoP is described. From an existing 2D assembly using a discrete 65-nm SoC product, the benefits of PoP integration using a next-generation (NG) 28-nm product with stacked memory are analyzed, based on simulation and predictive analysis performed using IC-EMC software platform.

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来源期刊

2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

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