基于光纤的板级光时钟分布的演示

Y. Li, J. Popelek, J. Rhee, L. Wang, T. Wang, K. Shum
{"title":"基于光纤的板级光时钟分布的演示","authors":"Y. Li, J. Popelek, J. Rhee, L. Wang, T. Wang, K. Shum","doi":"10.1109/MPPOI.1998.682147","DOIUrl":null,"url":null,"abstract":"Embedding of end-tapered, thin-cladding fiber bundles for board-level large bandwidth optical clock distributions is proposed and demonstrated. Fan-outs of up to 128-nodes on a printed circuit board of area as large as 13/spl times/19 cm/sup 2/ are experimentally demonstrated. Both silica and polymer fibers were tested. Performance parameters, such as fiber bending loss, attenuations, dispersions, coupling loss and uniformity were measured. Embedding of fibers on a double-layered chip-populated real PCB was performed.","PeriodicalId":248808,"journal":{"name":"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)","volume":"14 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Demonstration of fiber-based board-level optical clock distributions\",\"authors\":\"Y. Li, J. Popelek, J. Rhee, L. Wang, T. Wang, K. Shum\",\"doi\":\"10.1109/MPPOI.1998.682147\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Embedding of end-tapered, thin-cladding fiber bundles for board-level large bandwidth optical clock distributions is proposed and demonstrated. Fan-outs of up to 128-nodes on a printed circuit board of area as large as 13/spl times/19 cm/sup 2/ are experimentally demonstrated. Both silica and polymer fibers were tested. Performance parameters, such as fiber bending loss, attenuations, dispersions, coupling loss and uniformity were measured. Embedding of fibers on a double-layered chip-populated real PCB was performed.\",\"PeriodicalId\":248808,\"journal\":{\"name\":\"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)\",\"volume\":\"14 2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-06-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MPPOI.1998.682147\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MPPOI.1998.682147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

提出并演示了在板级大带宽光时钟分布中嵌入端锥形、薄包层光纤束。在面积达13/spl倍/19 cm/sup 2/的印刷电路板上,扇形输出可达128个节点。测试了二氧化硅纤维和聚合物纤维。测量了光纤弯曲损耗、衰减、色散、耦合损耗和均匀性等性能参数。将光纤嵌入到双层芯片填充的实际PCB上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Demonstration of fiber-based board-level optical clock distributions
Embedding of end-tapered, thin-cladding fiber bundles for board-level large bandwidth optical clock distributions is proposed and demonstrated. Fan-outs of up to 128-nodes on a printed circuit board of area as large as 13/spl times/19 cm/sup 2/ are experimentally demonstrated. Both silica and polymer fibers were tested. Performance parameters, such as fiber bending loss, attenuations, dispersions, coupling loss and uniformity were measured. Embedding of fibers on a double-layered chip-populated real PCB was performed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信