然后奇迹发生了:描述EUV辐射分解过程的问题及其与随机打印故障的关系(会议报告)

J. Petersen
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引用次数: 1

摘要

为极紫外线(EUV, 13.5 nm)辐射设计可行的可成像光刻胶材料,需要了解在材料内形成的能量管道,以提供化学相关的共振能量,从吸收92 eV电离辐射开始,在吸收后,产生光电子和二次电子,将能量分配到产生的二次电子中,每一代电子的数量增加,平均能量降低,直到它们达到0 eV。能量的损失是弹性和非弹性散射的结果。在能量高于30ev时,吸收会局限于抗蚀剂基质中分子上的原子上产生的电子会继续局部反应直到30- 20ev左右,深价区,它们开始离域并持续电离直到10ev,在此以下通过分子轨道相互作用,次级电子开始以虚光子的形式反应,直到低于3ev时,它们获得与振动能量共振的能量,形成稳定的自由基和离子,如果没有被具有共振的低未占据分子轨道(LUMO)的分子捕获,它们可能被材料或衬底中的空穴捕获,或者它们可能被困在材料系统中,而不发生反应。抗蚀剂设计者将有关高能粒子和光子与气体和生物系统相互作用的知识应用于光刻所用的较低能量,在聚合物抗蚀剂基质的凝聚态物质中截断在低于3ev。发生这种截断是因为分子键与“虚光子”的(量子)共振的作用通常在3到5ev之间。然而,由于存在多余的电子,稳定的阴离子和自由基(作为)反应物,这种截断是错误的;化学反应可能在能量接近0 eV时发生。这些化学反应是由瞬态电子与基质分子的低能量未占据分子轨道(LUMO)的振动共振引起的。这种行为在本质上是量子的,而不是经典的。本文从以下几个方面讨论了放射性溶解的过程:2.光子吸收从92 eV到30 eV的局部非分子过程。其次是30 ~ 10 eV以下的深价电离;其次是虚光子区域,从10ev到3ev, 4。然后检查低于3 eV至0 eV的情况。由于反应时间在阿秒到飞秒之间较短,对高能区的过程进行描述是困难的,但本文提出了实现这一目标的方法。在30 eV以下,等离子体充电功函数会给低能电子的总电子产额测量等方法带来问题,但时间分辨和使用极紫外暴露的各种分析方法将被证明是有用的。最后,本文考察了线边缘粗糙度、随机印刷失败和研究机会之间的关系,这些将把我们带到EUV光刻化学的边缘。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Then a miracle occurs: A description of the issues of EUV radiolysis process and the relationship to stochastic print failures (Conference Presentation)
The design of viable imageable photoresist materials for Extreme Ultra-Violet, EUV (13.5 nm), radiation requires the understanding of the energy conduits that form to deliver chemically relevant resonant energies within a material, Starting with absorption of a 92 eV ionizing radiation that, upon absorption, initiates a spawning of photoelectrons and secondary electrons that distribute energy across the population of generated secondary electrons with each subsequent generation’s electrons increasing in number and lower in average energy until they attain 0 eV. The loss of energy is the result of both elastic and inelastic scattering. At energies above 30 eV absorption is localized to atoms on the molecules in the resist matrix and the electrons that are spawned continue to react locally until then around 30-20 eV, the deep-valence region, they begin to delocalize and with continued ionization until 10 eV, that below this interacting through the molecular orbitals, the secondary electrons begin to react as virtual photons until below 3 eV where they attain energies that resonate with vibrational energies to form stable free radicals and ions that if not trapped by a molecule with a resonant low lying unoccupied molecular orbital (LUMO) may be captured by a hole in the material or substrate or they may get trapped in the material system as they are, without reacting. The resist designer applies knowledge concerning the interaction of high energy particles and photons with gases and biological systems to the lower energies used for lithography truncating at below 3 eV in the condensed matter of the polymeric resist matrix. This truncation occurs because the role of (quantum) resonance of a molecular bond with a “virtual photon” is typically between 3 and 5 eV. However, because of the presence of excess electron, stable anions, and radicals (as) reactants this truncation is erroneous; and chemistries may occur at energies approaching 0 eV. These chemistries result from vibrational resonances of the transient electron with a low energy unoccupied molecular orbitals (LUMO) of the matrix molecules. This behavior is quantum in nature and is not classical. This paper discusses the radiolysis processes as follows: 1. the local nonmolecular processes from 92 eV photon absorption to 30 eV, 2. then the ionization in the deep valence below 30 eV to 10 eV, 3. followed by the region of virtual photons from10 eV to 3 eV, 4. and then examine below 3 eV to 0 eV to finish. Describing the processes in the higher energy regions is difficult due to the short attosecond to femtosecond reaction time-resolution to monitor them but the paper proposes methods to accomplish. Below 30 eV the plasmonic charging work function pose problems for some methods like Total Electron Yield measurements of low energy electrons but time resolved and various analytical methods using EUV exposure will prove useful. The paper concludes by looking at the relationship to line-edge-roughness, stochastic print failures, and research opportunities that will take us to the edge of EUV lithographic chemistry.
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