Kyunghoon Kim, Joo-Hyung Chae, Jaehyeok Yang, Ji-Hyo Kang, Gang-Sik Lee, Sangyeon Byeon, Youngtaek Kim, Boram Kim, Donghoon Kim, Yeongmuk Cho, Kangmoo Choi, Hye-Lim Park, Junghwan Ji, S. Jeong, Yongsuk Joo, Jaehoon Cha, Mi-Lim Park, Hongdeuk Kim, Sijun Park, K. Kong, Sunho Kim, Sangkwon Lee, J. Chun, Hyung-Seuk Kim, S. Cha
{"title":"24Gb/s/引脚8Gb GDDR6,半速率菊花链时钟架构和低噪声操作IO电路","authors":"Kyunghoon Kim, Joo-Hyung Chae, Jaehyeok Yang, Ji-Hyo Kang, Gang-Sik Lee, Sangyeon Byeon, Youngtaek Kim, Boram Kim, Donghoon Kim, Yeongmuk Cho, Kangmoo Choi, Hye-Lim Park, Junghwan Ji, S. Jeong, Yongsuk Joo, Jaehoon Cha, Mi-Lim Park, Hongdeuk Kim, Sijun Park, K. Kong, Sunho Kim, Sangkwon Lee, J. Chun, Hyung-Seuk Kim, S. Cha","doi":"10.1109/ISSCC42613.2021.9365844","DOIUrl":null,"url":null,"abstract":"The demand for high-performance graphics systems used for artificial intelligence continues to grow; this trend requires graphics systems to achieve ever higher bandwidths. Enabling GDDR6 DRAM to achieve data rates beyond 18Gb/s/pin [1] requires identifying and solving factors that affect the speed of a memory interface. Prior studies have showed that the memory interface is vulnerable from the signal integrity (SI) and power integrity (PI) perspective, since it is based on a parallel interface using single-ended signaling. Furthermore, circuit schemes to mitigate process, voltage, and temperature (PVT) variations in sub-nanometer DRAM process are required to improve performance. To achieve 24Gb/s/pin on a 1.35V DRAM process, this work proposes a GDDR6 DRAM with a half-rate clocking architecture and optimized I/O.","PeriodicalId":371093,"journal":{"name":"2021 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"33 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A 24Gb/s/pin 8Gb GDDR6 with a Half-Rate Daisy-Chain-Based Clocking Architecture and IO Circuitry for Low-Noise Operation\",\"authors\":\"Kyunghoon Kim, Joo-Hyung Chae, Jaehyeok Yang, Ji-Hyo Kang, Gang-Sik Lee, Sangyeon Byeon, Youngtaek Kim, Boram Kim, Donghoon Kim, Yeongmuk Cho, Kangmoo Choi, Hye-Lim Park, Junghwan Ji, S. Jeong, Yongsuk Joo, Jaehoon Cha, Mi-Lim Park, Hongdeuk Kim, Sijun Park, K. Kong, Sunho Kim, Sangkwon Lee, J. Chun, Hyung-Seuk Kim, S. Cha\",\"doi\":\"10.1109/ISSCC42613.2021.9365844\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The demand for high-performance graphics systems used for artificial intelligence continues to grow; this trend requires graphics systems to achieve ever higher bandwidths. Enabling GDDR6 DRAM to achieve data rates beyond 18Gb/s/pin [1] requires identifying and solving factors that affect the speed of a memory interface. Prior studies have showed that the memory interface is vulnerable from the signal integrity (SI) and power integrity (PI) perspective, since it is based on a parallel interface using single-ended signaling. Furthermore, circuit schemes to mitigate process, voltage, and temperature (PVT) variations in sub-nanometer DRAM process are required to improve performance. To achieve 24Gb/s/pin on a 1.35V DRAM process, this work proposes a GDDR6 DRAM with a half-rate clocking architecture and optimized I/O.\",\"PeriodicalId\":371093,\"journal\":{\"name\":\"2021 IEEE International Solid- State Circuits Conference (ISSCC)\",\"volume\":\"33 1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-02-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Solid- State Circuits Conference (ISSCC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC42613.2021.9365844\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Solid- State Circuits Conference (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC42613.2021.9365844","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 24Gb/s/pin 8Gb GDDR6 with a Half-Rate Daisy-Chain-Based Clocking Architecture and IO Circuitry for Low-Noise Operation
The demand for high-performance graphics systems used for artificial intelligence continues to grow; this trend requires graphics systems to achieve ever higher bandwidths. Enabling GDDR6 DRAM to achieve data rates beyond 18Gb/s/pin [1] requires identifying and solving factors that affect the speed of a memory interface. Prior studies have showed that the memory interface is vulnerable from the signal integrity (SI) and power integrity (PI) perspective, since it is based on a parallel interface using single-ended signaling. Furthermore, circuit schemes to mitigate process, voltage, and temperature (PVT) variations in sub-nanometer DRAM process are required to improve performance. To achieve 24Gb/s/pin on a 1.35V DRAM process, this work proposes a GDDR6 DRAM with a half-rate clocking architecture and optimized I/O.