24Gb/s/引脚8Gb GDDR6,半速率菊花链时钟架构和低噪声操作IO电路

Kyunghoon Kim, Joo-Hyung Chae, Jaehyeok Yang, Ji-Hyo Kang, Gang-Sik Lee, Sangyeon Byeon, Youngtaek Kim, Boram Kim, Donghoon Kim, Yeongmuk Cho, Kangmoo Choi, Hye-Lim Park, Junghwan Ji, S. Jeong, Yongsuk Joo, Jaehoon Cha, Mi-Lim Park, Hongdeuk Kim, Sijun Park, K. Kong, Sunho Kim, Sangkwon Lee, J. Chun, Hyung-Seuk Kim, S. Cha
{"title":"24Gb/s/引脚8Gb GDDR6,半速率菊花链时钟架构和低噪声操作IO电路","authors":"Kyunghoon Kim, Joo-Hyung Chae, Jaehyeok Yang, Ji-Hyo Kang, Gang-Sik Lee, Sangyeon Byeon, Youngtaek Kim, Boram Kim, Donghoon Kim, Yeongmuk Cho, Kangmoo Choi, Hye-Lim Park, Junghwan Ji, S. Jeong, Yongsuk Joo, Jaehoon Cha, Mi-Lim Park, Hongdeuk Kim, Sijun Park, K. Kong, Sunho Kim, Sangkwon Lee, J. Chun, Hyung-Seuk Kim, S. Cha","doi":"10.1109/ISSCC42613.2021.9365844","DOIUrl":null,"url":null,"abstract":"The demand for high-performance graphics systems used for artificial intelligence continues to grow; this trend requires graphics systems to achieve ever higher bandwidths. Enabling GDDR6 DRAM to achieve data rates beyond 18Gb/s/pin [1] requires identifying and solving factors that affect the speed of a memory interface. Prior studies have showed that the memory interface is vulnerable from the signal integrity (SI) and power integrity (PI) perspective, since it is based on a parallel interface using single-ended signaling. Furthermore, circuit schemes to mitigate process, voltage, and temperature (PVT) variations in sub-nanometer DRAM process are required to improve performance. To achieve 24Gb/s/pin on a 1.35V DRAM process, this work proposes a GDDR6 DRAM with a half-rate clocking architecture and optimized I/O.","PeriodicalId":371093,"journal":{"name":"2021 IEEE International Solid- State Circuits Conference (ISSCC)","volume":"33 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A 24Gb/s/pin 8Gb GDDR6 with a Half-Rate Daisy-Chain-Based Clocking Architecture and IO Circuitry for Low-Noise Operation\",\"authors\":\"Kyunghoon Kim, Joo-Hyung Chae, Jaehyeok Yang, Ji-Hyo Kang, Gang-Sik Lee, Sangyeon Byeon, Youngtaek Kim, Boram Kim, Donghoon Kim, Yeongmuk Cho, Kangmoo Choi, Hye-Lim Park, Junghwan Ji, S. Jeong, Yongsuk Joo, Jaehoon Cha, Mi-Lim Park, Hongdeuk Kim, Sijun Park, K. Kong, Sunho Kim, Sangkwon Lee, J. Chun, Hyung-Seuk Kim, S. Cha\",\"doi\":\"10.1109/ISSCC42613.2021.9365844\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The demand for high-performance graphics systems used for artificial intelligence continues to grow; this trend requires graphics systems to achieve ever higher bandwidths. Enabling GDDR6 DRAM to achieve data rates beyond 18Gb/s/pin [1] requires identifying and solving factors that affect the speed of a memory interface. Prior studies have showed that the memory interface is vulnerable from the signal integrity (SI) and power integrity (PI) perspective, since it is based on a parallel interface using single-ended signaling. Furthermore, circuit schemes to mitigate process, voltage, and temperature (PVT) variations in sub-nanometer DRAM process are required to improve performance. To achieve 24Gb/s/pin on a 1.35V DRAM process, this work proposes a GDDR6 DRAM with a half-rate clocking architecture and optimized I/O.\",\"PeriodicalId\":371093,\"journal\":{\"name\":\"2021 IEEE International Solid- State Circuits Conference (ISSCC)\",\"volume\":\"33 1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-02-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Solid- State Circuits Conference (ISSCC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC42613.2021.9365844\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Solid- State Circuits Conference (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC42613.2021.9365844","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

对用于人工智能的高性能图形系统的需求持续增长;这种趋势要求图形系统实现更高的带宽。要使GDDR6 DRAM实现超过18Gb/s/pin的数据速率[1],需要识别和解决影响内存接口速度的因素。先前的研究表明,从信号完整性(SI)和功率完整性(PI)的角度来看,存储接口是脆弱的,因为它是基于使用单端信令的并行接口。此外,为了提高性能,需要在亚纳米DRAM工艺中减小工艺、电压和温度(PVT)变化的电路方案。为了在1.35V DRAM上实现24Gb/s/pin,本工作提出了一种具有半速率时钟架构和优化I/O的GDDR6 DRAM。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 24Gb/s/pin 8Gb GDDR6 with a Half-Rate Daisy-Chain-Based Clocking Architecture and IO Circuitry for Low-Noise Operation
The demand for high-performance graphics systems used for artificial intelligence continues to grow; this trend requires graphics systems to achieve ever higher bandwidths. Enabling GDDR6 DRAM to achieve data rates beyond 18Gb/s/pin [1] requires identifying and solving factors that affect the speed of a memory interface. Prior studies have showed that the memory interface is vulnerable from the signal integrity (SI) and power integrity (PI) perspective, since it is based on a parallel interface using single-ended signaling. Furthermore, circuit schemes to mitigate process, voltage, and temperature (PVT) variations in sub-nanometer DRAM process are required to improve performance. To achieve 24Gb/s/pin on a 1.35V DRAM process, this work proposes a GDDR6 DRAM with a half-rate clocking architecture and optimized I/O.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信