Yuto Kubota, I. Shohji, T. Tsuchida, Kiyotomo Nakamura
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Tensile properties of low-melting point Sn-Bi-Sb solder
Tensile properties of Sn-57.5Bi-0.5Sb (mass%) lead-free solder were investigated with miniature size specimens and the results were compared to those of Sn-58Bi (mass%) and Sn-3.0Ag-0.5Cu (mass%). At 25°C, tensile properties of Sn-57.5Bi-0.5Sb are similar to those of Sn-58Bi. At high temperatures, tensile strength and 0.1% proof stress of Sn-57.5Bi-0.5Sb becomes to be lower than those of Sn-58Bi and Sn-3.0Ag-0.5Cu. On the other hand, elongation of Sn-57.5Bi-0.5Sb is somewhat superior to that of Sn-58Bi and much higher than that of Sn-3.0Ag-0.5Cu at high temperatures. Characteristic change of them can be explained by the refinement of micro structure due to the addition of a small amount of Sb to Sn-Bi solder.
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