小尺寸焊球缺陷检测方法的研究

2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2017-11-01 DOI:10.1109/ICAM.2017.8242171

Xiuyun Zhou, Yaqiu Chen, Xiaochuan Lu

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引用次数: 2

摘要

为了解决高密度芯片中小尺寸焊锡球缺陷检测问题，提出了基于脉冲涡流热成像技术(ECPT)的焊锡球缺陷研究方法。通过建立三维感应加热有限元模型，通过对比不同温度场来区分裂纹、空隙等缺陷。此外，还对不同缺陷和不同裂纹尺寸的焊料球进行了实验。实验结果和仿真研究验证了ECPT方法的可靠性和方便性。

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Study on detection method of small-size solder ball defects

In order to solve defect detection problem of small-size solder ball in the high density chip, the method based on the pulsed eddy current thermal imaging technology (ECPT) was put forward to study the solder ball defects. With establishing 3D induction heating finite element model, the defects such as cracks, voids can be distinguished by comparing the different temperature field. Furthermore, the experiments with solder balls of different defects and various crack size are carried out. Both experiment result and simulation study verify the reliability and convenience of ECPT method.

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来源期刊

2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)

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