通过集成的子晶圆厂数据管理提供关键工艺实现真空能力

Erik Collart, M. Mooney, Luke Evason, Vincent Giorgi, David Hunt, Antonio Serapiglia, A. Ifould
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引用次数: 2

摘要

分厂及其真空、减排和辅助系统多年来发生了巨大的变化。在许多方面,它已经变得和晶圆厂本身一样复杂,现在提供关键的使能工艺技术。半导体制造商也越来越认识到,当涉及到晶圆厂工艺和良率优化时,子晶圆厂信息再也不能被忽视。将讨论可用的子晶圆厂数据源,如设备参数、工艺数据和设备故障分析,以及如何集成这些数据源,以提供整体子晶圆厂健康监测,并提供当今领先技术节点所需的真空条件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Providing Key Process Enabling Vacuum Capability Through Integrated Sub-Fab Data Management
The sub-fab, with its vacuum, abatement and ancillary systems has evolved dramatically over the years. In many ways it has become as sophisticated as the fab itself, and now provides key enabling process technology. There is also a growing recognition among semiconductor manufacturers that sub-fab information can no longer be dismissed when it comes to fab process and yield optimization. Available sub-fab data sources such as equipment parameters, process data and equipment fault analyses will be discussed, as well as how these may be integrated to provide overall sub fab health monitoring and deliver vacuum conditions required by today’s leading-edge technology nodes.
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