光学干涉和光声作为原位技术表征多孔硅地层:综述

C. F. Ramirez-Gutierrez, J. D. Castaño-Yepes, M. Rodriguez-Garcia
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引用次数: 7

摘要

多孔硅(PSi)是一种突破性的材料,因为它的物理化学性质可以通过其孔隙度来定制。这意味着,监测和控制的增长参数允许制造基于psi的系统与受控的性质。干涉测量和光声学是一种非侵入性、非接触式、实时(原位)技术,用于表征PSi形成过程中发生的现象。这项工作提出了与上述技术的实施相关的数学和实验方面,这些技术旨在表征氟基电解质介质中PSi的生长。这些方法可以确定PSi的宏观参数,如厚度、孔隙率剖面(EMA)、折射率、蚀刻速率和RMS粗糙度等。这些技术的监测能力在很大程度上取决于所使用的辐射波长。然而,可以监测λ0/4到~ 1/ α0的厚度,其中α0是λ0处的光学吸收系数。此外,这些技术可以实现作为反馈控制蚀刻工艺的制造PSi。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optical interferometry and photoacoustics as in-situ techniques to characterize the porous silicon formation: a review
Abstract Porous Silicon (PSi) is a groundbreaking material because its physicochemical properties can be customized through its porosity. This means that monitoring and control of the growing parameters allows the fabrication of PSi-based systems with controlled properties. Interferometry and photoacoustics are non -invasive, non - contact, real-time (in-situ) techniques used to characterize the phenomena that takes place during the formation of PSi. This work presents the mathematical and experimental aspects related to the implementation of the techniques mentioned above, which are meant to characterize the PSi growth in fluoride-based electrolyte media. These methods can determine macroscopic parameters of PSi such as thickness, porosity profile trough effective medium approximation (EMA), refractive index, etching rate, and RMS roughness under 100 nm. The monitoring ability of these techniques is strongly dependent on the wavelength of radiation used. However, it is possible to monitor thickness from λ0/4 to ∼ 1/ α0, where α0 is the optical absorption coefficient at λ0. Also, these techniques can be implemented as feedback control on the etching processes for fabrication of PSi.
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