由分布式喷嘴单元组成的非接触输送系统的研制

1999 7th IEEE International Conference on Emerging Technologies and Factory Automation. Proceedings ETFA '99 (Cat. No.99TH8467) Pub Date : 1999-10-18 DOI:10.1109/ETFA.1999.815409

S. Konishi, Y. Mizuguchi, K. Ohno

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引用次数: 12

摘要

为了处理半导体晶圆等物体，需要非接触式操作。本文研究了一种利用气流使物体悬浮和移动的输送系统。根据工厂生产线的不同布局调整系统组成也很重要。本研究采用由多单元组成的分布式系统的概念。我们开发了基本单元，以便根据其布局安排运输系统。开发并演示了尺寸为100 mm/spl倍/100 mm/spl倍/30 mm的基本单元原型。为了评价所开发系统的性能，采用了实验研究方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Development of a non-contact conveyance system composed of distributed nozzle units

A non-contact manipulation is required in order to treat such objects as semiconductor wafers. This paper deals with a conveyance system using an air flow to levitate and move the objects. It is also important to adapt the system composition for various layouts of factory lines. This research employs the concept of distributed systems composed of many units. We have developed elemental units so as to arrange a conveyance system according to its layout. A prototype of the elemental unit, whose dimensions are 100 mm/spl times/100 mm/spl times/30 mm, is developed and demonstrated. Experimental investigation is applied in order to evaluate characteristics of the developed system.

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1999 7th IEEE International Conference on Emerging Technologies and Factory Automation. Proceedings ETFA '99 (Cat. No.99TH8467)

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