微波应用的低成本包装解决方案

2006 European Microwave Integrated Circuits Conference Pub Date : 2006-09-01 DOI:10.1109/EMICC.2006.282788

R. Wormald, S. David, G. Panaghiston, R. Jeffries

{"title":"微波应用的低成本包装解决方案","authors":"R. Wormald, S. David, G. Panaghiston, R. Jeffries","doi":"10.1109/EMICC.2006.282788","DOIUrl":null,"url":null,"abstract":"Lower cost solutions for packaging GaAs pHEMT devices, MMIC's and multi chip modules (MCM's) are now an essential requirement for high-rel military applications. This is very apparent in phased array applications where a large number of modules can have significant cost implications. A potential, novel, near hermetic and cost effective packaging solution, available in low to medium volumes, using liquid crystal polymer (LCP) laminates and conventional PCB manufacturing techniques is discussed","PeriodicalId":269652,"journal":{"name":"2006 European Microwave Integrated Circuits Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2006-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"A Low Cost Packaging Solution for Microwave Applications\",\"authors\":\"R. Wormald, S. David, G. Panaghiston, R. Jeffries\",\"doi\":\"10.1109/EMICC.2006.282788\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Lower cost solutions for packaging GaAs pHEMT devices, MMIC's and multi chip modules (MCM's) are now an essential requirement for high-rel military applications. This is very apparent in phased array applications where a large number of modules can have significant cost implications. A potential, novel, near hermetic and cost effective packaging solution, available in low to medium volumes, using liquid crystal polymer (LCP) laminates and conventional PCB manufacturing techniques is discussed\",\"PeriodicalId\":269652,\"journal\":{\"name\":\"2006 European Microwave Integrated Circuits Conference\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 European Microwave Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMICC.2006.282788\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 European Microwave Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMICC.2006.282788","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

摘要

封装GaAs pHEMT器件，MMIC和多芯片模块(MCM)的低成本解决方案现在是高分辨率军事应用的基本要求。这在相控阵应用中非常明显，因为大量模块可能会产生重大的成本影响。本文讨论了一种潜在的、新颖的、接近密封的、具有成本效益的封装解决方案，该解决方案使用液晶聚合物(LCP)层压板和传统的PCB制造技术，可用于低到中体积

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A Low Cost Packaging Solution for Microwave Applications

Lower cost solutions for packaging GaAs pHEMT devices, MMIC's and multi chip modules (MCM's) are now an essential requirement for high-rel military applications. This is very apparent in phased array applications where a large number of modules can have significant cost implications. A potential, novel, near hermetic and cost effective packaging solution, available in low to medium volumes, using liquid crystal polymer (LCP) laminates and conventional PCB manufacturing techniques is discussed

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2006 European Microwave Integrated Circuits Conference

自引率

0.00%

发文量