{"title":"展望大型集成阵列的未来成本","authors":"R. Noyce","doi":"10.1145/1464291.1464302","DOIUrl":null,"url":null,"abstract":"Technology in integrated circuits has advanced to the point where we are considering integration on a substantially larger scale than is done today. In a companion paper to this one, R. L. Petritz has discussed the technological basis underlying large scale integration. It is the purpose of this paper to briefly review the motivation for the electronics industry to proceed to higher level integration, and to discuss in particular the cost implications of large scale integration.","PeriodicalId":297471,"journal":{"name":"AFIPS '66 (Fall)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1899-12-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A look at future costs of large integrated arrays\",\"authors\":\"R. Noyce\",\"doi\":\"10.1145/1464291.1464302\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Technology in integrated circuits has advanced to the point where we are considering integration on a substantially larger scale than is done today. In a companion paper to this one, R. L. Petritz has discussed the technological basis underlying large scale integration. It is the purpose of this paper to briefly review the motivation for the electronics industry to proceed to higher level integration, and to discuss in particular the cost implications of large scale integration.\",\"PeriodicalId\":297471,\"journal\":{\"name\":\"AFIPS '66 (Fall)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1899-12-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"AFIPS '66 (Fall)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/1464291.1464302\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"AFIPS '66 (Fall)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1464291.1464302","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Technology in integrated circuits has advanced to the point where we are considering integration on a substantially larger scale than is done today. In a companion paper to this one, R. L. Petritz has discussed the technological basis underlying large scale integration. It is the purpose of this paper to briefly review the motivation for the electronics industry to proceed to higher level integration, and to discuss in particular the cost implications of large scale integration.