埋层基板中螺旋电感的可扩展SPICE模型

A. Ciccazzo, G. Greco, S. Rinaudo
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引用次数: 4

摘要

在射频应用领域中,经常需要在各种工作频率的基础上正确表示电感器的固有特性。一些出版物已经处理了基于或多或少电阻基板的集成电感器的建模。毫无疑问,最有趣的方法是那些基于回合合成为阶梯网络的分布式模型的方法。这些创新模型的主要缺点是其固有的复杂性,因此难以将其作为SPICE器件模型实现,难以在电路仿真工具中轻松使用。研究人员主要关注基于CLOS衬底的电感器的建模,而在电阻埋藏层少的衬底上制作分布式电感器模型的工作还很少。目前,处理此类配置文件的技术在意法半导体中集成,用于模拟和数字设计。在本文中,我们的目的是,首先,描述一个创新的分布式电感器模型集成在基片上的埋层,其次,展示一个创新的自动方法,允许通过优化过程,合成一个可用的SPICE模型基于上述新模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A new scalable SPICE model for spiral inductors in substrate with buried layer
In the radio frequency application field, the needs to use inductor models whose intrinsic characteristics are correctly represented on the basis of the various working frequencies often arise. Several publications have treated modeling of integrated inductors based on a more or less resistive substrate. Undoubtedly the most interesting approaches are those based on distributed models of turns synthesize as ladder network. The main disadvantage of these innovative models is their intrinsic complexity and therefore the difficulty to implement them as SPICE device models to be easily used in circuit simulation tools. Researchers have mainly focused their attention on the modeling of inductors based on CLOS substrate but there is no work on distributed inductor model made on the substrate with little resistive buried layer. At present, technologies that deal with such profiles are integrated in STMicroelectronics for analog and digital designs. In this paper, our aim is, firstly, to describe an innovative distributed inductor model integrated on substrate with buried layer and, secondly, to show an innovative automatic methodology which allows synthesizing, through an optimization procedure, a usable SPICE model based on the new model described above.
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