HyperX:高效大规模网络的拓扑、路由和封装

Jung Ho Ahn, N. Binkert, A. Davis, M. McLaren, R. Schreiber
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引用次数: 259

摘要

在实现百亿亿级性能的推动下,系统将增长到超过100,000个插槽,因为每个插槽不断增长的核心和改进的单核性能只能提供所需的部分加速。这些系统将需要可负担得起的互连结构来扩展到这个级别。为了满足这一需求,我们考虑了超立方体和扁平蝴蝶拓扑的扩展HyperX,并给出了一种自适应路由算法DAL。HyperX利用集成光子学将提供的高基数开关组件。我们的主要贡献包括一个正式的描述框架,使搜索方法能够找到最佳的HyperX配置;木豆;以及用于百亿亿次HyperX的低成本封装策略。模拟表明,HyperX可以提供与折叠Clos一样好的性能,并且开关更少。我们还描述了一种降低系统成本的HyperX封装方案。我们对效率、性能和封装的分析表明,HyperX是百亿亿级网络的有力竞争对手。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
HyperX: topology, routing, and packaging of efficient large-scale networks
In the push to achieve exascale performance, systems will grow to over 100,000 sockets, as growing cores-per-socket and improved single-core performance provide only part of the speedup needed. These systems will need affordable interconnect structures that scale to this level. To meet the need, we consider an extension of the hypercube and flattened butterfly topologies, the HyperX, and give an adaptive routing algorithm, DAL. HyperX takes advantage of high-radix switch components that integrated photonics will make available. Our main contributions include a formal descriptive framework, enabling a search method that finds optimal HyperX configurations; DAL; and a low cost packaging strategy for an exascale HyperX. Simulations show that HyperX can provide performance as good as a folded Clos, with fewer switches. We also describe a HyperX packaging scheme that reduces system cost. Our analysis of efficiency, performance, and packaging demonstrates that the HyperX is a strong competitor for exascale networks.
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