热循环冲击耦合多物理场载荷下三维CSP MEMS和IC的可靠性分析

Shuye Zhang, Jianhao Xu, Shang Zhang, P. He, Mingjia Sun, Jianqun Yang, Xingji Li, K. Paik
{"title":"热循环冲击耦合多物理场载荷下三维CSP MEMS和IC的可靠性分析","authors":"Shuye Zhang, Jianhao Xu, Shang Zhang, P. He, Mingjia Sun, Jianqun Yang, Xingji Li, K. Paik","doi":"10.1109/ECTC32696.2021.00221","DOIUrl":null,"url":null,"abstract":"In this paper, reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads was investigated. COMSOL Multiphysics, a finite element software, was used to analyze the mechanical behavior of our device under a −55°C/125°C thermal cycling and 1500G@1ms with half-sine pulse impact coupled load. MEMS chip was bonded on a silicon interposer by solder balls. An application specific integrated circuit (ASIC) for the signal processing was placed on the interposer beneath the MEMS. Combining the effects of thermal stress and impact loads, we hope to find out the failure modes of interconnect structures including solder joints and whole device. The deformation and stress distribution of the overall device will be carried out for layout optimization of interconnect structures.","PeriodicalId":351817,"journal":{"name":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads\",\"authors\":\"Shuye Zhang, Jianhao Xu, Shang Zhang, P. He, Mingjia Sun, Jianqun Yang, Xingji Li, K. Paik\",\"doi\":\"10.1109/ECTC32696.2021.00221\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads was investigated. COMSOL Multiphysics, a finite element software, was used to analyze the mechanical behavior of our device under a −55°C/125°C thermal cycling and 1500G@1ms with half-sine pulse impact coupled load. MEMS chip was bonded on a silicon interposer by solder balls. An application specific integrated circuit (ASIC) for the signal processing was placed on the interposer beneath the MEMS. Combining the effects of thermal stress and impact loads, we hope to find out the failure modes of interconnect structures including solder joints and whole device. The deformation and stress distribution of the overall device will be carried out for layout optimization of interconnect structures.\",\"PeriodicalId\":351817,\"journal\":{\"name\":\"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC32696.2021.00221\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32696.2021.00221","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文研究了三维CSP MEMS和集成电路在热循环冲击耦合多物理场载荷下的可靠性分析。利用有限元软件COMSOL Multiphysics分析了该器件在- 55°C/125°C热循环和1500G@1ms半正弦脉冲冲击耦合载荷下的力学行为。用焊料球将MEMS芯片粘接在硅中间层上。用于信号处理的专用集成电路(ASIC)被放置在MEMS下面的中间层上。结合热应力和冲击载荷的影响,我们希望找出互连结构包括焊点和整个器件的破坏模式。将对整个装置进行变形和应力分布,以优化互连结构的布局。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads
In this paper, reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads was investigated. COMSOL Multiphysics, a finite element software, was used to analyze the mechanical behavior of our device under a −55°C/125°C thermal cycling and 1500G@1ms with half-sine pulse impact coupled load. MEMS chip was bonded on a silicon interposer by solder balls. An application specific integrated circuit (ASIC) for the signal processing was placed on the interposer beneath the MEMS. Combining the effects of thermal stress and impact loads, we hope to find out the failure modes of interconnect structures including solder joints and whole device. The deformation and stress distribution of the overall device will be carried out for layout optimization of interconnect structures.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信