集成电路工艺中晶圆温度监测的研究

Chao Wang, Jing Jiang
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引用次数: 0

摘要

实时准确的温度监测对于严格控制集成电路制造过程中的晶圆温度至关重要,有助于高性能芯片的制造。本文对IC工艺中各种晶圆温度监测方法的研究现状进行了综述。设计了集成主控制电路、电池和多个温度传感器的晶片,用于现场温度监测。结合重构算法,重构了集成硅片的二维温度场。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research on Wafer Temperature Monitoring in IC Process
The real-time and accurate temperature monitoring is very important for strictly controlling the wafer temperature in the process of integrated circuits (IC) manufacturing, which is conductive to the fabricating of high-performance chips. In this report, the current research of various methods of wafer temperature monitoring in IC process has been summarized. A wafer integrating main control circuit, batteries and multiple temperature sensors is constructed for the in-situ temperature monitoring. Combined with the reconstruction algorithm, the two-dimensional temperature field of the integrated wafer is reconstructed.
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