固化工艺对ptf导电浆料应用质量的影响

J. Schulze, R. Bauer
{"title":"固化工艺对ptf导电浆料应用质量的影响","authors":"J. Schulze, R. Bauer","doi":"10.1109/ISSE.2012.6273100","DOIUrl":null,"url":null,"abstract":"The Polymer Thick Film Technology permits a cost efficient production of electronic circuits. The technology permits through a screen printing process the application of different polymer pastes of flexible and rigid substrate. This allows the production of electronic circuits in a short time. After that are develop the functional characteristics of the polymer pastes through a temperature process. Like any technology have this some disadvantages such as low electrical conductivity and limited assembly capability.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"77 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Influence of curing technologies on the application quality of PTF-conductive pastes\",\"authors\":\"J. Schulze, R. Bauer\",\"doi\":\"10.1109/ISSE.2012.6273100\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Polymer Thick Film Technology permits a cost efficient production of electronic circuits. The technology permits through a screen printing process the application of different polymer pastes of flexible and rigid substrate. This allows the production of electronic circuits in a short time. After that are develop the functional characteristics of the polymer pastes through a temperature process. Like any technology have this some disadvantages such as low electrical conductivity and limited assembly capability.\",\"PeriodicalId\":277579,\"journal\":{\"name\":\"2012 35th International Spring Seminar on Electronics Technology\",\"volume\":\"77 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-05-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 35th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2012.6273100\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2012.6273100","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

聚合物厚膜技术使电子电路的生产具有成本效益。该技术允许通过丝网印刷工艺应用柔性和刚性基材的不同聚合物浆料。这样可以在短时间内生产出电子电路。然后,通过温度过程开发聚合物糊的功能特性。像任何技术一样,它也有一些缺点,比如导电性低和组装能力有限。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of curing technologies on the application quality of PTF-conductive pastes
The Polymer Thick Film Technology permits a cost efficient production of electronic circuits. The technology permits through a screen printing process the application of different polymer pastes of flexible and rigid substrate. This allows the production of electronic circuits in a short time. After that are develop the functional characteristics of the polymer pastes through a temperature process. Like any technology have this some disadvantages such as low electrical conductivity and limited assembly capability.
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