基于平面ECT技术的便携式包装检测成像方法

Yongbo He, Zhaoyang Chen, Shuhao Zhang
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引用次数: 0

摘要

为了实现中小快递点高介电常数危险品的快速检测与成像,提出了一种基于平面ECT技术的包装检测三维成像方法;首先,对传统平面ECT的电极矩阵进行优化,设计了一种线性检测电极阵列的平面ECT传感器;然后,建立了待测封装在不同介电常数下的仿真模型。检测时,将检测极板置于封装顶部,缓慢移动,获取封装不同区域检测极板的电容信号;最后,采用等面法对封装对象进行局部和全三维成像。实验结果表明,所设计的检测方法可以实现高含水量包装及金属危险品的三维成像。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Portable package detection imaging method based on planar ECT technology
In order to realize the rapid detection and imaging of dangerous goods with high dielectric constant at small and mediumsized express points, a three-dimensional imaging method for packaging inspection based on planar ECT technology was proposed; Firstly, the electrode matrix of traditional planar ECT is optimized, and a planar ECT sensor with linear detection electrode array is designed; Then, the simulation model of the package to be tested under different dielectric constants is established. During the detection, the electrode plate is placed on the top of the package and moved slowly to obtain the capacitance signal of the detection electrode plate in different areas of the package; Finally, the iso-surface method is used for partial and full 3D imaging of the object in the package. The experimental results show that the designed detection method can realize three-dimensional imaging of high water content in packaging and metal dangerous goods.
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