印制电路板内嵌电容器长期稳定性分析

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887647

A. Kłossowicz, P. Winiarski, M. Zawierta, W. Stęplewski, A. Dziedzic

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引用次数: 2

摘要

本文对嵌入式印刷电路板电容器的长期稳定性进行了研究。由FaradFlex介质箔制成的平面电容器与铜板层压在FR-4衬底上作为测试结构。电介质为BaTiO3陶瓷/聚合物组合物，具有不同的填料，因而具有不同的介电常数。此外，测试样品的成分厚度和表面尺寸也存在差异。所研究的电容器表面覆盖有LDP 2×106(激光可钻预浸料)保护层，以实现嵌入式结构。为了确定电容和耗散因子在1 kHz和10 kHz两个频率值下的长期稳定性，研究了电容和耗散因子的行为。进行了原位加速老化过程(在老化条件下直接进行试样的电容和耗散系数)，进行了长期行为分析。为了确定环境暴露对老化过程的影响，研究了老化过程前后的温度特性。此外，还对电压和温度应力下的绝缘电阻进行了监测和分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Analysis of long-term stability of capacitors embedded in printed circuit boards

This paper presents studies of long-term stability of capacitors embedded in printed circuit boards. Planar capacitors fabricated from FaradFlex dielectric foil with copper plates laminated to FR-4 substrate served as test structures. The dielectric was BaTiO3 ceramic/polymer composition with various fillers and consequently various dielectric constants. Moreover test samples differed in composition thickness and surface size. The investigated capacitors were covered with LDP 2×106 (Laser Drillable Prepreg) protective layers to achieve embedded structures. The behaviour of capacitance as well as dissipation factor was investigated for two values of frequency (1 and 10 kHz) in order to determine their long-term stability. The in-situ accelerated ageing process (capacitance and dissipation factor of test samples performed directly at the ageing conditions) was carried out to perform long-term behaviour analysis. Temperature characteristics both before and after aging process were performed for determination of influence of environmental exposure. Additionally insulation resistance under voltage and temperature stress was monitored and analyzed.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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