{"title":"电子封装的室内和室外应用-经济方面的两个试点项目","authors":"B. Ulrich","doi":"10.1109/INTLEC.1990.171305","DOIUrl":null,"url":null,"abstract":"Availability of a modern telecommunications system as a function of correct operation of its power supply, heat transfer, and cooling is addressed. Two projects were carried out: one was a powered and cooled cabinet for outdoor applications and the second was a liquid-cooled MS 2000-300A/C power supply system with an energy saving heat transfer and cooling system. The infrastructure supplied with the cabinet consists of an uninterruptible power supply system, cooling system and other equipment necessary for operation in a telecommunications environment. Liquid cooling of the second project is based on a consistent heat evacuation from heat dissipating devices through a low thermal resistance, primarily metallic pad (eg, advanced PCBs) on the device and module level, to the liquid thermal bus on the rack, room, and building level. The concept of the two projects and the results of the operational test are presented.<<ETX>>","PeriodicalId":264940,"journal":{"name":"12th International Conference on Telecommunications Energy","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1990-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Electronic packaging for indoor and outdoor applications-the economic aspects of two pilot projects\",\"authors\":\"B. Ulrich\",\"doi\":\"10.1109/INTLEC.1990.171305\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Availability of a modern telecommunications system as a function of correct operation of its power supply, heat transfer, and cooling is addressed. Two projects were carried out: one was a powered and cooled cabinet for outdoor applications and the second was a liquid-cooled MS 2000-300A/C power supply system with an energy saving heat transfer and cooling system. The infrastructure supplied with the cabinet consists of an uninterruptible power supply system, cooling system and other equipment necessary for operation in a telecommunications environment. Liquid cooling of the second project is based on a consistent heat evacuation from heat dissipating devices through a low thermal resistance, primarily metallic pad (eg, advanced PCBs) on the device and module level, to the liquid thermal bus on the rack, room, and building level. The concept of the two projects and the results of the operational test are presented.<<ETX>>\",\"PeriodicalId\":264940,\"journal\":{\"name\":\"12th International Conference on Telecommunications Energy\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"12th International Conference on Telecommunications Energy\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/INTLEC.1990.171305\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"12th International Conference on Telecommunications Energy","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INTLEC.1990.171305","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electronic packaging for indoor and outdoor applications-the economic aspects of two pilot projects
Availability of a modern telecommunications system as a function of correct operation of its power supply, heat transfer, and cooling is addressed. Two projects were carried out: one was a powered and cooled cabinet for outdoor applications and the second was a liquid-cooled MS 2000-300A/C power supply system with an energy saving heat transfer and cooling system. The infrastructure supplied with the cabinet consists of an uninterruptible power supply system, cooling system and other equipment necessary for operation in a telecommunications environment. Liquid cooling of the second project is based on a consistent heat evacuation from heat dissipating devices through a low thermal resistance, primarily metallic pad (eg, advanced PCBs) on the device and module level, to the liquid thermal bus on the rack, room, and building level. The concept of the two projects and the results of the operational test are presented.<>
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