硬实时系统的周期性热管理

Long Cheng, Kai Huang, Gang Chen, Biao Hu, A. Knoll
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引用次数: 7

摘要

随着功率密度的增大,芯片内温度的迅速升高,严重影响了现代实时系统的可靠性和性能。本文研究了在硬实时约束下采用周期性热管理的硬实时系统的峰值温度最小化问题。为解决这一问题,导出了这种周期格式的峰值温度的封闭形式表示。在此基础上,利用到达曲线模型对系统工作负荷进行建模,提出了两种周期热管理方法,在复杂性和准确性之间进行权衡,以最小化给定事件流的峰值温度。案例研究表明,我们的方法可以达到相似或更好的峰值温度水平,但与以前的工作相比,计算费用降低了两到三个数量级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Periodic thermal management for hard real-time systems
Due to growing power density, on-chip temperature increases rapidly, which has hampered the reliability and performance of modern real-time systems. This paper studies how to minimize the peak temperature for hard real-time systems under hard real-time constraints with periodic thermal management. A closed-form representation of the peak temperature for such a periodic scheme is derived to tackle this problem. Based on this closed-form and the arrival curve model which is used to model the system workload, two approaches that can derive periodic thermal management are proposed to minimize the peak temperature for a given event stream with a trade-off between complexity and accuracy. Case studies show that our approaches can achieve similar or better level of peak temperature but with two or three orders of magnitude lower computation expense compared to previous work.
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