焊料替换

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI:10.1109/IEMT.1993.398211

H. Hvims

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引用次数: 5

摘要

讨论了导电胶粘剂在印刷电路板表面贴装技术(SMT)上替代焊料的应用。选用了多种导电胶粘剂。两个关键问题之一是揭示粘合剂类型及其成分的市场。二是元器件端接和印刷电路表面类型对粘接稳定性影响的技术研究。对两种不同金属表面上的四种不同类型的粘合剂与传统焊料技术进行了比较。所有胶粘剂变体都经过显微切片，以进行冶金和微观结构检查。对胶粘剂中金属颗粒的x射线能量色散分析(EDAX)进行了研究并进行了记录。简要报道了导电接头的返工。讨论了与粘合剂类型有关的工作的职业健康方面。讨论了环氧基胶粘剂的工作原理。

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Solder replacement

The use of conductive adhesives as a replacement for solder on surface mount technology (SMT) printed circuit boards is discussed. A number of conductive adhesives has been selected. One of the two key issues is to uncover the market for adhesive types and their composition. The other is the technical investigation of the influence of component termination and printed circuit surface types on adhesive bonding stability. Four different types of adhesives on two different metal surfaces are compared with conventional solder technology. All adhesive variants are microsectioned for metallurgical and microstructure examination. Energy dispersive analysis of X-ray (EDAX) of the metal particles in the adhesive is carried out and documented. Rework of conductive joints is briefly reported. Aspects of occupational health are discussed concerning work with adhesive types. Work with epoxy based adhesives is discussed.<>

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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