低侧开关设计中的功耗考虑

CAS 2010 Proceedings (International Semiconductor Conference) Pub Date : 2010-12-03 DOI:10.1109/SMICND.2010.5650563

A. Danchiv, Marian Hulub, Diana Manta

{"title":"低侧开关设计中的功耗考虑","authors":"A. Danchiv, Marian Hulub, Diana Manta","doi":"10.1109/SMICND.2010.5650563","DOIUrl":null,"url":null,"abstract":"This paper presents a fully protected low side switch design from the thermal behavior perspective. The power dissipation is evaluated both for normal operation and for the main high power operation conditions: short circuit and overload, inductive clamping and turn on/off process. Electro-thermal simulations are used to evaluate the surface temperature, that is taken into account in designing the protection functions.","PeriodicalId":377326,"journal":{"name":"CAS 2010 Proceedings (International Semiconductor Conference)","volume":"156 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Power dissipation considerations in low side switch design\",\"authors\":\"A. Danchiv, Marian Hulub, Diana Manta\",\"doi\":\"10.1109/SMICND.2010.5650563\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a fully protected low side switch design from the thermal behavior perspective. The power dissipation is evaluated both for normal operation and for the main high power operation conditions: short circuit and overload, inductive clamping and turn on/off process. Electro-thermal simulations are used to evaluate the surface temperature, that is taken into account in designing the protection functions.\",\"PeriodicalId\":377326,\"journal\":{\"name\":\"CAS 2010 Proceedings (International Semiconductor Conference)\",\"volume\":\"156 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-12-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"CAS 2010 Proceedings (International Semiconductor Conference)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2010.5650563\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"CAS 2010 Proceedings (International Semiconductor Conference)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2010.5650563","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文从热行为的角度提出了一种全保护低侧开关的设计。对正常运行和主要高功率运行条件(短路和过载、电感夹紧和开/关过程)的功耗进行评估。电热模拟用于评估表面温度，并在设计保护功能时考虑到表面温度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Power dissipation considerations in low side switch design

This paper presents a fully protected low side switch design from the thermal behavior perspective. The power dissipation is evaluated both for normal operation and for the main high power operation conditions: short circuit and overload, inductive clamping and turn on/off process. Electro-thermal simulations are used to evaluate the surface temperature, that is taken into account in designing the protection functions.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

CAS 2010 Proceedings (International Semiconductor Conference)

自引率

0.00%

发文量