pcb级热与SI/PI联合分析:进展与方向

2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Pub Date : 2022-09-01 DOI:10.1109/APEMC53576.2022.9888294

Zhixin Xia, Yunlong Luo, Y. Qi, Jun Fan, X. Ye

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引用次数: 0

摘要

随着大规模集成电路的日益强大，产品的功耗逐渐增加，导致PCB上的温度升高，进一步加剧了高速数字系统中的信号完整性问题。因此，分析和解决由PCB热效应引起的问题是非常必要的。简要概述了热与信号完整性/功率完整性(SI/PI)协同分析的研究进展和未来发展方向，分析了层压材料介电性能的测量技术，讨论了温度对高速PCB传输性能的影响。

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PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions

As large-scale integrated circuits have become increasingly powerful, the power consumption of products has gradually increased, which has caused the temperature on PCB to rise and further aggravated the signal integrity problems in high-speed digital systems. Therefore, it is essential to analyze and solve those problems caused by the thermal effect on the PCB. This paper briefly overviewed the progress and future directions of thermal & signal integrity/power integrity (SI/PI) co-analysis, analyzed the measurement techniques of the dielectric properties of laminate materials, and discussed the influence of temperature on high-speed PCB transmission performance.

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2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

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