利用栅极-源极短路耗尽型MOSFET与源极串联实现600 V GaN场效应管的短路能力

Ajit Kanale, B. Baliga
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引用次数: 3

摘要

氮化镓场效应管在高直流母线电压和导通栅极驱动电压下的抗短路能力较差。在本文中,基本(DMM)拓扑结构采用低电压硅耗尽型MOSFET (DMM)串联GaN FET源,以抑制峰值短路电流并延长SC耐受时间。实验结果提供了市售的600 V级联码GaN场效应管。在漏极偏置为400 V、栅极偏置为8 V时,SC的耐受时间从0.33美元增加到4.35美元,提高了13倍。在正常的功率电路工作条件下,基本(DMM)拓扑产生的导通电阻增加29%,开关损耗几乎没有变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Achieving Short Circuit Capability for 600 V GaN FETs Using a Gate-Source-Shorted Si Depletion-Mode MOSFET in Series with the Source
Gallium Nitride FETs have poor short-circuit withstand capability at high DC bus voltages with on-state gate drive voltage. In this paper, the BaSIC(DMM) topology that employs a low voltage Si depletion-mode MOSFET (DMM) in series with source of the GaN FET is demonstrated to suppress the peak short-circuit current and extend the SC withstand time. Experimental results are provided for commercially available 600 V Cascode GaN FETs. The SC withstand time was increased from 0.33 $\mu$ s to 4.35 $\mu$ s at a drain bias of 400 V with gate bias of 8 V, an improvement by a factor of 13x. Under normal power circuit operating conditions, the BaSIC(DMM) topology produces a 29 % increase in on-resistance and almost no change in switching losses.
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