{"title":"关于包装造型","authors":"J. Ladvánszky","doi":"10.1109/EUMA.1994.337453","DOIUrl":null,"url":null,"abstract":"Our purpose is twofold: to compare two frequently used circuits modelling MESFET and HEMT packages, and to outline a novel task description for optimizing circuit elements of the package model.","PeriodicalId":440371,"journal":{"name":"1994 24th European Microwave Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"On package modelling\",\"authors\":\"J. Ladvánszky\",\"doi\":\"10.1109/EUMA.1994.337453\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Our purpose is twofold: to compare two frequently used circuits modelling MESFET and HEMT packages, and to outline a novel task description for optimizing circuit elements of the package model.\",\"PeriodicalId\":440371,\"journal\":{\"name\":\"1994 24th European Microwave Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 24th European Microwave Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUMA.1994.337453\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 24th European Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMA.1994.337453","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Our purpose is twofold: to compare two frequently used circuits modelling MESFET and HEMT packages, and to outline a novel task description for optimizing circuit elements of the package model.
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