{"title":"LTCC模块中固体和栅格参考电源/地平面的频域特性","authors":"A. Jancura, Guang Chen","doi":"10.1109/ECTC.2002.1008072","DOIUrl":null,"url":null,"abstract":"This paper presents simulation and experimental results for gridded power/ground plane structures in LTCC-modules. The approach of using different simulation techniques for power/ground structures is discussed and a wire-trace model for solid-gridded plane pair based on the transmission line model is derived and verified with measurements.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Frequency domain behavior of solid and gridded reference power/ground planes in LTCC modules\",\"authors\":\"A. Jancura, Guang Chen\",\"doi\":\"10.1109/ECTC.2002.1008072\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents simulation and experimental results for gridded power/ground plane structures in LTCC-modules. The approach of using different simulation techniques for power/ground structures is discussed and a wire-trace model for solid-gridded plane pair based on the transmission line model is derived and verified with measurements.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008072\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008072","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Frequency domain behavior of solid and gridded reference power/ground planes in LTCC modules
This paper presents simulation and experimental results for gridded power/ground plane structures in LTCC-modules. The approach of using different simulation techniques for power/ground structures is discussed and a wire-trace model for solid-gridded plane pair based on the transmission line model is derived and verified with measurements.