实现PZT厚膜微驱动器的沉积和图像化技术

Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135) Pub Date : 1998-07-13 DOI:10.1109/IMNC.1998.730068

R. Maeda, J. Chu, A. Schroth, J. Akedo, M. Ichiki, Z. Wang, S. Yonekubo

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引用次数: 0

摘要

简介:PZT薄层沉积技术在存储器制造应用领域已达到先进水平。另一方面，PZT层在微机电系统(MEMS)驱动中的应用还不是很成熟。在这种应用中需要较厚的薄膜。传统的制备技术提供了较差的沉积速率，并且沉积过程中积累的残余应力导致沉积层状结构的剥落。另一个难点在于Si02/Ti/Pt/PZT/Ti/Pt多层结构的蚀刻速率低。

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Deposition And Patterning Technique For Realization Of PZT Thick Film Micro Actuator

Introduction: Deposition technology of thin PZT layer has reached an advanced state in the application area of memory fabrication. On the other hand, the application of PZT layer for actuation of micro electromechanical system (MEMS) is not well established. Relatively thicker film is necessary in this application. Conventional preparation techniques provide poor deposition rates and the accumulated residual stress during deposition results in peal off of the deposited layered structure. Another difficulty lies in the low etching rate of the multilayered structure of Si02/Ti/Pt/PZT/Ti/Pt.

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Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)

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