UltraScale CLB架构的增强

Shant Chandrakar, D. Gaitonde, T. Bauer
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引用次数: 15

摘要

每一代FPGA架构都受益于围绕其技术节点和目标使用的优化。在本文中,我们讨论了赛灵思20nm UltraScale产品系列对CLB所做的一些更改。我们激励这些变更,并在各种指标上证明比以前的CLB体系结构更好的结果。我们表明,在要求苛刻的情况下,放置在UltraScale设备中的逻辑需要的无线长度比7系列少16%。映射到UltraScale设备的设计也需要更少的逻辑块。在本文中,我们展示了由于某些CLB增强而带来的UltraScale CLB的利用优势。本文所描述的增强使示例设计套件的包装平均改进了3%。我们还表明,与前几代FPGA相比,UltraScale架构可以更优雅地处理激进、更紧凑的封装。这些显著减少的无线长度和CLB数量直接转化为功率、性能和易用性方面的优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhancements in UltraScale CLB Architecture
Each generation of FPGA architecture benefits from optimizations around its technology node and target usage. In this paper, we discuss some of the changes made to the CLB for Xilinx's 20nm UltraScale product family. We motivate those changes and demonstrate better results than previous CLB architectures on a variety of metrics. We show that, in demanding scenarios, logic placed in an UltraScale device requires 16% less wirelength than 7-series. Designs mapped to UltraScale devices also require fewer logic tiles. In this paper, we demonstrate the utilization benefits of the UltraScale CLB attributed to certain CLB enhancements. The enhancements described herein result in an average packing improvement of 3% for the example design suite. We also show that the UltraScale architecture handles aggressive, tighter packing more gracefully than previous generations of FPGA. These significant reductions in wirelength and CLB counts translate directly into power, performance and ease-of-use benefits.
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