新型半导体器件

{"title":"新型半导体器件","authors":"B. Weiss","doi":"10.1049/ecej:19990601","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":127784,"journal":{"name":"Electronics & Communication Engineering Journal","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"New semiconductor devices\",\"authors\":\"B. Weiss\",\"doi\":\"10.1049/ecej:19990601\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":127784,\"journal\":{\"name\":\"Electronics & Communication Engineering Journal\",\"volume\":\"44 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electronics & Communication Engineering Journal\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1049/ecej:19990601\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronics & Communication Engineering Journal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1049/ecej:19990601","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}