对称惠斯通微悬臂传感器与片上温度传感器

A. Tuantranont, T. Lomas, K. Jaruwongrungsi, A. Jomphoak, A. Wisitsora-at
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引用次数: 0

摘要

这项工作的重点是带有片上温度传感器的对称惠斯通MEMS悬臂梁的设计、有限元建模和测试。用多晶硅压阻传感技术研究了金表面的应力感应。原则上,生化物质在微加工悬臂的功能化表面上的吸附会引起表面应力,从而导致悬臂弯曲。传感机制依赖于封装在光束内的多晶硅线的压阻特性。制作了梁,并进行了弯曲分析,从而可以预测梁的尖端挠度。梁上的压敏电阻设计是多种多样的,在一定的限制下,使外部读出电路可以测量传感技术的灵敏度。0.0058-0.0110 g的质量检测由梁电阻系列作为平衡惠斯通电桥配置进行测量。电桥的电压输出与MEMS悬臂梁的弯曲量成正比。实验对传感器的温度依赖性和性能进行了表征。基片上的电阻作为温度传感器进行补偿,显著降低了温度依赖效应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Symmetrical Wheatstone Microcantilever Sensor with On-chip Temperature Sensors
This work has focused on the design, finite element modeling and testing of a symmetrical Wheatstone MEMS cantilever beam with on-chip temperature sensors. The stress induced on gold surface with polysilicon piezoresistive sensing is demonstrated. In principle, adsorption of biochemical species on a functionalized surface of the microfabricated cantilever will cause a surface stress and consequently the cantilever bending. The sensing mechanism relies on the piezoresistive properties of the polysilicon wires encapsulated inside the beam. The beam is fabricated and bending analysis is performed so that the beam tip deflection could be predicted. The piezoresistor designs on the beams were varied, within certain constraints, so that external read-out circuit could measure the sensitivity of the sensing technique. The mass detection of 0.0058-0.0110 g is measured by the beam resistor series as a balanced Wheatstone bridge configuration. The voltage output of the bridge is directly proportional to the amount of bending in the MEMS cantilever. The temperature dependency and sensor performance have been characterized in experiments. Compensation by resisters on the substrate, which act as temperature sensors significantly reduces the temperature dependence effect.
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