利用各种金属真空沉积方法获得热元件的接触系统

A. Kozlov, E. Korchagin, B. Mustafoev, A. Babich, M. Rogachev
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引用次数: 0

摘要

考虑到热电元件触点质量的主要标准(高粘附强度和低接触电阻),通过真空沉积金属开发了地层触点系统的方法。提出了热电材料(Bi2Te2.8Se0.2和Bi0.5Sb1.5Te3)在真空沉积薄膜前对样品表面进行机械处理和清洗的方法。研究了磁控溅射和电子束蒸发获得镍触点的方法。该技术用于测定接触电阻。得到了厚度为300 nm的镍接触体系,其平均附着强度为21.5 MPa,最大值为23.0 MPa。结果表明,磁控溅射形成的接触系统比电子束蒸发形成的接触系统的附着强度高15-20%。接触系统的比接触电阻在10-9欧姆*m2水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Obtaining Contact Systems to Thermoelements Using Various Methods of Vacuum Deposition of Metals
Taking into account the main criteria for quality contacts for thermoelements (high adhesion strength and low contact resistance), methods were developed for formation contact systems by vacuum deposition of metals. Methods of mechanical treatment and cleaning of sample surface of thermoelectric materials (Bi2Te2.8Se0.2 and Bi0.5Sb1.5Te3) before vacuum deposition of thin films were proposed. Modes for obtaining Ni contacts by magnetron sputtering and electron beam evaporation were worked out. The technique was developed to determine contact resistance. Nickel contact systems with a thickness of 300 nm were obtained with average values of adhesion strength up to 21.5 MPa, with its maximum values up to 23.0 MPa. It was established that contact systems formed by magnetron sputtering have an adhesion strength 15-20% higher than contacts formed by electron beam evaporation. The specific contact resistance of the contact systems was at the level of 10-9 Ohm*m2.
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