基于Si CMOS电路的三维堆叠薄膜探测器的智能像素多光谱成像阵列设计

2000 Digest of the LEOS Summer Topical Meetings. Electronic-Enhanced Optics. Optical Sensing in Semiconductor Manufacturing. Electro-Optics in Space. Broadband Optical Networks (Cat. No.00TH8497) Pub Date : 2000-07-24 DOI:10.1109/LEOSST.2000.869697

K. Lee, S. Seo, S. Huang, Y. Joo, W. Doolittle, S. Fike, N. Jokerst, M. Brooke, A. Brown

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引用次数: 4

摘要

我们讨论了一种智能多光谱成像系统的设计，该系统可以由独立优化的探测器阵列和Si CMOS电路组成，它们在三维上堆叠在一起，以完成多光谱图像的物理配准。这款智能多光谱成像仪利用薄膜GaN (UV)、MCT (MWIR)和Si CMOS电路的异质集成，创造了异质集成能力的杰出例子，用于使用电子信号处理能力增强光学系统。

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Design of a smart pixel multispectral imaging array using 3D stacked thin film detectors on Si CMOS circuits

We discuss the design of a smart multispectral imaging system which can be fabricated with independently optimized detector arrays and Si CMOS circuits, which are stacked in three dimensions on top of one another for complete physical registration of the multispectral image. This smart multispectral imager utilizes the heterogeneous integration of thin film GaN (UV), MCT (MWIR), and Si CMOS circuitry to create an outstanding example of the power of heterogeneous integration for enhancing optical systems using electronic signal processing capabilities.

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2000 Digest of the LEOS Summer Topical Meetings. Electronic-Enhanced Optics. Optical Sensing in Semiconductor Manufacturing. Electro-Optics in Space. Broadband Optical Networks (Cat. No.00TH8497)

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