EKC265熔池寿命及焊垫氟碳污染的研究

ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187) Pub Date : 1998-11-24 DOI:10.1109/SMELEC.1998.781140

L. An, K. Lai, W. Chay, Y. Hua

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引用次数: 2

摘要

对EKC265清洗浴寿命进行了研究。采用俄歇分析技术对EKC265工艺后粘结垫的氟、碳污染程度进行了评价。结果表明，对L95批次进行EKC265清洗是必要且有效的。目前使用的40批粘结垫表面(0 /spl Aring/)的C和F污染水平分别为20 %和7.5 %。然而，他们都是0。%，深度为50 /spl。结果还表明，为了降低成本，可以将EKC265的浴槽寿命从40批次(6英寸)延长到50批次(6英寸)。

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A study on EKC265 bath life and fluorine and carbon contamination on bond pads

A study was conducted on EKC265 cleaning bath life. The Auger analysis technique was used to evaluate the contamination levels of fluorine and carbon on the bond pad after the EKC265 process. The results showed that it is necessary and effective to perform EKC265 cleaning for L95 lots. The contamination levels of C and F on the surface (0 /spl Aring/) of bond pads were about 20 at% and 7.5 at% at the bath life of 40 lots used currently. However, they were 0 at.% at a depth of 50 /spl Aring/. The results also show that it is possible to extend EKC265 bath life from 40 lots (6 inch) to 50 lots (6 inch) for cost reduction purposes.

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ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187)

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