n极性(GaN)/InN表面的材料和电学性能

K. Cico, A. Adikimenakis, M. Mičušík, S. Hascik, A. Georgakilas, J. Kuzmík
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引用次数: 0

摘要

裸InN表面的角度分辨xps分析显示,在1.1 nm处,表面电子积累和负能带弯曲约为0.65 eV。另一方面,通过用2到4层氮化镓单层覆盖InN表面,这种效应大大降低。结果表明,部分应变帽层的氮化镓/氮化镓界面存在负极化电荷,并消除氮化镓表面的悬垂键。CCl2F2中的RIE提供了GaN在InN上的高选择性蚀刻。ALD沉积Al2O3在(GaN)/InN表面形成具有金属绝缘体-类金属行为的结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Material and electrical properties of N-polar (GaN)/InN surfaces
Angle-resolved XPS-analysis of the bare InN surface has revealed surface electron accumulation and negative band bending by about 0.65 eV at a distance of 1.1 nm. On the other hand this effect was substantially reduced by capping the InN surface by 2 to 4 monolayer of GaN. Negative polarisation charge at the GaN/InN interface of (partially) strained cap layer together with elimination of dangling bonds at the InN surface were consequently suggested. RIE in CCl2F2 provided highly selective etching of GaN over InN. Al2O3 deposited by ALD on (GaN)/InN surface created structures with metal-insulator-metal-like behaviour.
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