{"title":"基于0.18µm SiGe BiCMOS工艺的x波段4×4片上管家矩阵设计","authors":"Xiaohui Tao, Rui Cao, Zhuang Li, Dawei Rong, Lihui Jiang, Liguo Sun","doi":"10.1109/ICCT46805.2019.8947045","DOIUrl":null,"url":null,"abstract":"In this paper, an X-band 4×4 on-chip butler matrix is presented based on 0.18$\\mu$m SiGe BiCMOS process. The matrix, implemented by lumped components such as inductors and capacitors, shows broadband performance with the size less than 2mm2. The measurement results are consistent with simulation ones.","PeriodicalId":306112,"journal":{"name":"2019 IEEE 19th International Conference on Communication Technology (ICCT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of X-band 4×4 On-chip Butler Matrix Based on 0.18µm SiGe BiCMOS Process\",\"authors\":\"Xiaohui Tao, Rui Cao, Zhuang Li, Dawei Rong, Lihui Jiang, Liguo Sun\",\"doi\":\"10.1109/ICCT46805.2019.8947045\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, an X-band 4×4 on-chip butler matrix is presented based on 0.18$\\\\mu$m SiGe BiCMOS process. The matrix, implemented by lumped components such as inductors and capacitors, shows broadband performance with the size less than 2mm2. The measurement results are consistent with simulation ones.\",\"PeriodicalId\":306112,\"journal\":{\"name\":\"2019 IEEE 19th International Conference on Communication Technology (ICCT)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 19th International Conference on Communication Technology (ICCT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCT46805.2019.8947045\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 19th International Conference on Communication Technology (ICCT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCT46805.2019.8947045","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design of X-band 4×4 On-chip Butler Matrix Based on 0.18µm SiGe BiCMOS Process
In this paper, an X-band 4×4 on-chip butler matrix is presented based on 0.18$\mu$m SiGe BiCMOS process. The matrix, implemented by lumped components such as inductors and capacitors, shows broadband performance with the size less than 2mm2. The measurement results are consistent with simulation ones.