高温气相外延法生长GaN和AlGaN

S. Fischer, F. Anders, M. Theis, G. Steude, T. Christmann, D. Hofmann, B. Meyer
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引用次数: 0

摘要

研究了生长温度对氮化镓高温气相外延的影响。在生长速率和Ga蒸气压之间几乎成正比。在最佳条件下,生长速度高达210 /spl亩/米/小时(T=1150/spl度/c)。最大生长速率被认为受到氨供应和氮化镓起始成分的限制。在最佳GaN生长条件下,从先前合金化的Al-Ga以及Ga和Al的共蒸发开始生长AlGaN层。添加Al可显著降低生长速率并提高层的均匀性。然而,在几乎所有的情况下,发现相分离。除了GaN和AlN二元相外,还存在中间的AlGaN相。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Growth of GaN and AlGaN by high temperature vapor phase epitaxy
We investigated the influence of the growth temperature on high temperature vapor phase epitaxy of GaN. An almost direct proportionality between the growth rate and the Ga vapor pressure is observed. At optimum conditions growth rates as high as 210 /spl mu/m/h (T=1150/spl deg/c) are achieved. The maximum growth rate is believed to be limited by the supply of ammonia and the starting composition of GaN. Under optimum GaN growth conditions AlGaN layers were grown starting from previously alloyed Al-Ga as well as from co-evaporation of Ga and Al. Adding Al leads to a significant reduction of growth rate and increases the homogeneity of the layers. However, in almost all cases phase separation is found. Besides the binary GaN and AlN phases an intermediate AlGaN phase appears.
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