对转移电子振荡器噪声的新认识

H. Gnerlich, J. Ondria
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引用次数: 0

摘要

测量了低频电流和电压波动,并证实了封装的转移电子器件(ted)中的噪声是由三种不同的噪声机制引起的:闪烁、产生-重组和热噪声。对于转移电子振荡器(TEOs),这种低频噪声未转换为微波频率范围,并增加了固有的射频噪声。我们发现,在1 kHz和1 MHz之间的载波,温度相关的产生重组噪声是总噪声的主要贡献者。提出了一种改进的噪声TEO模型。该模型允许根据测量的低频噪声的设备和电路参数计算调幅和调频噪声谱,或者从噪声和电路参数测量中推导设备特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A New Look at Noise in Transferred Electron Oscillators
Low frequency current and voltage fluctuations have been measured, and it has been confirmed that noise in packaged Transferred Electron Devices (TEDs) is due to three distinct noise mechanisms: Flicker, generation-recombination, and thermal noise. For Transferred Electron Oscillators (TEOs), this low frequency noise is unconverted into the microwave frequency range and adds to the intrinsic RF noise. We have found that, between 1 kHz and 1 MHz off the carrier, temperature dependent generation-recombination noise is the main contributor to the total noise. An improved model of a noisy TEO is presented. This model permits the calculation of AM and FM noise spectra from device and circuit parameters for measured low frequency noise or the derivation of device characteristics from noise and circuit parameter measurements.
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