G. C. Barisich, E. Gebara, Huifang Gu, C. Storey, Pouya Aflaki, J. Papapolymerou
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引用次数: 7
摘要
采用NRC的0.15 pm氮化镓(GaN)单片微波集成电路(MMIC)工艺设计、制作和测量了一种三级宽带功率放大器(PA)。在对高电子迁移率晶体管(HEMT)进行表征后,根据测量数据创建了一个非线性模型,用于设计。响应匹配的3.8 mm × 1.8 mm PA还使用电阻元件进行增益补偿和电路稳定性。在20 dBm源功率下的测量显示,在6至17 GHz带宽上,输出功率为35-38 dBm, PAE为10-18%。这些结果表明,在此功率范围内,此带宽的3级GaN MMIC PA的每个芯片面积的最高输出功率。
Reactively matched 3-stage C-X-Ku band GaN MMIC power amplifier
A 3-stage wideband power amplifier (PA) using a 0.15 pm gallium nitride (GaN) monolithic microwave integrated circuit (MMIC) process from NRC is designed, fabricated, and measured. After characterization of the high electron mobility transistor (HEMT), a non-linear model was created from the measured data for use in the design. The reactively matched 3.8 mm × 1.8 mm PA also uses resistive elements for gain compensation and circuit stability. Measurements at 20 dBm source power show 35–38 dBm output power and 10–18% PAE over a 6 to 17 GHz bandwidth. These results demonstrate the highest output power per die area for a 3-stage GaN MMIC PA of this bandwidth in this power range.