基于吸收材料的结构抑制芯片封装中的有害辐射

2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Pub Date : 2022-09-01 DOI:10.1109/APEMC53576.2022.9888463

Jiaqi Xing, Xinglei Liang, Yudi Fan, Ling Zhang, Da Li, Erping Li

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引用次数: 0

摘要

本文提出了一种双层结构吸波材料，用于解决芯片封装中的电磁辐射问题。这种低轮廓的吸波器结构由两层扁平结构组成，下层由相对介电常数较高的吸波材料制成，上层由相对介电常数较低的材料制成，以更好地满足宽阻抗匹配的要求。首先在理论和全波仿真的基础上设计了该结构。然后在实际的芯片封装模型中，制作并应用于工作在20-40GHz频率范围内的不同吸波材料来抑制辐射。最后，通过测量不同吸波材料设置下的辐射抑制效果，验证了该结构的有效性和通用性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Absorptive-Material-Based Structure for Suppressing Unwanted Radiation in Chip-Packages

In this paper, a double-layer structured absorptive material for solving the electromagnetic radiation problems in chip-packages is proposed. This low-profile absorber structure is composed of two flat layers where the lower layer is made of absorbing material with high relative permittivity, while the upper layer is made of material with low relative permittivity to better meet the requirements of wide impedance matching. This structure is firstly designed based on theories and full-wave simulations. Then it is fabricated and applied to different absorbing materials working in the frequency range of 20-40GHz to suppress the radiation in a practical chip-package model. Finally, the effectiveness and universality of this structure are verified through measurements of the radiation suppression effect with different absorbing material settings.

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2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

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