用于300 GHz室内无线通信的MMIC芯片组

2015 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS) Pub Date : 2015-12-21 DOI:10.1109/COMCAS.2015.7360494

I. Kallfass, P. Harati, I. Dan, J. Antes, F. Boes, S. Rey, T. Merkle, S. Wagner, H. Massler, A. Tessmann, A. Leuther

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引用次数: 23

摘要

这个贡献提出了一个完整的芯片组，专用于高数据速率室内无线通信在300 GHz载波频率。模拟前端由三芯片解决方案组成，即发射器、接收器和本地振荡器倍频器。有源毫米波单片集成电路采用基于砷化镓的高电子迁移率晶体管技术实现。发射机MMIC最大输出功率为3.6 dBm，射频频率范围为270 ~ 314 GHz。在292 ~ 314 GHz的射频频率范围内，无中频放大的接收机MMIC显示11.4 dB转换增益。

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MMIC chipset for 300 GHz indoor wireless communication

This contribution presents a full chip set dedicated to high data rate indoor wireless communication at a carrier frequency of 300 GHz. The analog frontend consists of a three-chip solution, namely a transmitter, receiver and local oscillator frequency multiplier. The active millimeter-wave monolithic integrated circuits are realized in a GaAs-based metamorphic high electron mobility transistor technology. The transmitter MMIC achieves a maximum output power of 3.6 dBm and an RF frequency range of 270 to 314 GHz. The receiver MMIC shows 11.4 dB conversion gain without IF amplification in an RF frequency range from 292 to 314 GHz.

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2015 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS)

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