使用粘性牵引的无接触薄衬底传输

2012 Second Workshop on Design, Control and Software Implementation for Distributed MEMS Pub Date : 2012-04-02 DOI:10.1109/DMEMS.2012.19

R. V. van Ostayen, J. van Eijk, R. M. Schmidt

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引用次数: 3

摘要

介绍了一种适用于硅片等薄型易碎产品的新型无接触传输系统。产品在将产品与系统分离的空气薄膜上进行运输，并利用与系统表面平行和相邻的加压和运动空气膜的相对速度进行运输。这种创新的概念可以产生高精度定位和高效产品运输所需的高刚度和加速度。本文介绍了该系统的基本设计原理。在六自由度气动平面高精度定位台上进行了实验验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Contact-Less Thin Substrate Transport Using Viscous Traction

A new contact-less transport system for thin and fragile products like silicon wafers is introduced. The product is carried on a thin film of air separating the product from the system, and is transported using the relative velocity of the pressurized and moving air film parallel and adjacent to the system surface. This innovative concept can produce both the high stiffness and acceleration required for high precision positioning and efficient product transport. In this paper the basic design principles of this system are presented. Experimental verification is demonstrated on a 6-dof planar air actuated high precision positioning stage.

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来源期刊

2012 Second Workshop on Design, Control and Software Implementation for Distributed MEMS

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