焦点控制增强和产品焦点响应分析方法

Young Ki Kim, Yen-Jen Chen, Xueli Hao, Pavan Samudrala, Juan-Manuel Gomez, Mark O. Mahoney, F. Kamalizadeh, J. K. Hanson, Shawn Lee, Ye Tian
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引用次数: 2

摘要

随着20/14nm及以上技术的临界聚焦深度(CDOF)的降低,对焦误差对产品性能的影响越来越大。目前在大批量生产中的产品焦点控制技术是有限的;由于缺乏可靠的焦点测量方法,现有方法难以确定可测量的焦点误差和优化产品的焦点响应。除了扫描仪成像和焦点控制能力的发展以及一般工具稳定性维护之外,还需要改进产品上的焦点控制,以满足产品上的成像规范。本文通过基于衍射的聚焦(DBF)测量方法,讨论了聚焦监测、晶圆(边缘)指纹校正和产品上聚焦预算分析。几个例子将展示更好的焦点响应和控制产品晶圆。此外,还将讨论一种用于大批量生产(HVM)环境的产品聚焦联锁自动化系统的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Focus control enhancement and on-product focus response analysis methodology
With decreasing CDOF (Critical Depth Of Focus) for 20/14nm technology and beyond, focus errors are becoming increasingly critical for on-product performance. Current on product focus control techniques in high volume manufacturing are limited; It is difficult to define measurable focus error and optimize focus response on product with existing methods due to lack of credible focus measurement methodologies. Next to developments in imaging and focus control capability of scanners and general tool stability maintenance, on-product focus control improvements are also required to meet on-product imaging specifications. In this paper, we discuss focus monitoring, wafer (edge) fingerprint correction and on-product focus budget analysis through diffraction based focus (DBF) measurement methodology. Several examples will be presented showing better focus response and control on product wafers. Also, a method will be discussed for a focus interlock automation system on product for a high volume manufacturing (HVM) environment.
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