用于红外成像应用的直径达6英寸的外延晶片的大批量制造方法的快速发展

Nathan W. Gray, A. Prax, D. E. Johnson, Jonathan Demke, J. Bolke, W. Alexander
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引用次数: 1

摘要

我们提出了一种用于红外成像应用的低成本,高质量的锑化镓(GaSb)衬底的新方法。这些方法应用了硅工业的大批量晶圆制造标准,以提高我们晶圆的性能和价值。使用改进的Czochralski方法生长无封装的GaSb单晶,每个晶体产生70多个150mm晶圆或数百个75mm或100mm晶圆。这些被加工成外延基板,在其上生长超晶格结构。晶圆和外延结构的表征,包括透射x射线形貌,掺杂水平和均匀性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Rapid development of high-volume manufacturing methods for epi-ready GaSb wafers up to 6” diameter for IR imaging applications
We present a new method to produce low-cost, high quality gallium antimonide (GaSb) substrates for IR imaging applications. These methods apply high-volume wafer manufacturing standards from the silicon industry to increase performance and value of our wafers. Encapsulant-free GaSb single crystals were grown using the modified Czochralski method, yielding more than seventy 150mm wafers per crystal or several hundred 75mm or 100mm wafers per crystal. These were processed into epi-ready substrates on which superlattice structures were grown. Wafer and epitaxy structure characterization is also presented, including transmission X-ray topography, dopant level and uniformity.
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