{"title":"固态变压器中压绝缘高频pcb绕组变压器设计","authors":"Zheqing Li, Feng Jin, Yi-Hsun Hsieh, Qiang Li","doi":"10.1109/APEC43580.2023.10131159","DOIUrl":null,"url":null,"abstract":"A Solid-state transformer directly reduces medium voltage to low voltage (e.g. 400 V) with minimized power conversion stages. Insulation structure is the bottleneck of DC-DC module in SST from insulation effectiveness, manufacturing process, thermal management, and power density point of view. In this paper, a compact PCB-winding transformer structure is proposed to handle the medium voltage insulation by FR4 in PCB-winding. The primary side winding is built in PCB-winding and secondary side winding is still Litz wire for a lower loss. With semi-conductive shielding and stress grading layer design, the E-field can be restrained in the primary side PCB for a partial discharge free insulation. An arc section winding structure is proposed to reduce the high E-field inside the insulation layer to improve insulation performance. The layer-to-layer winding resistance and overall loss/footprint trade-off is analyzed for a low loss design. Finally, the design is demonstrated on an 800/400V, 15-kW, 200-kHz CLLC converter with 98.8% peak efficiency and 130W/in3 power density, whose transformer achieves partial discharge free up to 14.6kV.","PeriodicalId":151216,"journal":{"name":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A High-Frequency PCB-Winding Transformer Design with Medium Voltage Insulation for Solid-State Transformer\",\"authors\":\"Zheqing Li, Feng Jin, Yi-Hsun Hsieh, Qiang Li\",\"doi\":\"10.1109/APEC43580.2023.10131159\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A Solid-state transformer directly reduces medium voltage to low voltage (e.g. 400 V) with minimized power conversion stages. Insulation structure is the bottleneck of DC-DC module in SST from insulation effectiveness, manufacturing process, thermal management, and power density point of view. In this paper, a compact PCB-winding transformer structure is proposed to handle the medium voltage insulation by FR4 in PCB-winding. The primary side winding is built in PCB-winding and secondary side winding is still Litz wire for a lower loss. With semi-conductive shielding and stress grading layer design, the E-field can be restrained in the primary side PCB for a partial discharge free insulation. An arc section winding structure is proposed to reduce the high E-field inside the insulation layer to improve insulation performance. The layer-to-layer winding resistance and overall loss/footprint trade-off is analyzed for a low loss design. Finally, the design is demonstrated on an 800/400V, 15-kW, 200-kHz CLLC converter with 98.8% peak efficiency and 130W/in3 power density, whose transformer achieves partial discharge free up to 14.6kV.\",\"PeriodicalId\":151216,\"journal\":{\"name\":\"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEC43580.2023.10131159\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC43580.2023.10131159","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A High-Frequency PCB-Winding Transformer Design with Medium Voltage Insulation for Solid-State Transformer
A Solid-state transformer directly reduces medium voltage to low voltage (e.g. 400 V) with minimized power conversion stages. Insulation structure is the bottleneck of DC-DC module in SST from insulation effectiveness, manufacturing process, thermal management, and power density point of view. In this paper, a compact PCB-winding transformer structure is proposed to handle the medium voltage insulation by FR4 in PCB-winding. The primary side winding is built in PCB-winding and secondary side winding is still Litz wire for a lower loss. With semi-conductive shielding and stress grading layer design, the E-field can be restrained in the primary side PCB for a partial discharge free insulation. An arc section winding structure is proposed to reduce the high E-field inside the insulation layer to improve insulation performance. The layer-to-layer winding resistance and overall loss/footprint trade-off is analyzed for a low loss design. Finally, the design is demonstrated on an 800/400V, 15-kW, 200-kHz CLLC converter with 98.8% peak efficiency and 130W/in3 power density, whose transformer achieves partial discharge free up to 14.6kV.