T. Amemiya, T. Hiratani, D. Inoue, T. Tomiyasu, K. Fukuda, N. Nishiyama, S. Arai
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Toward the practical use of on-chip optical interconnection in Si LSIs, we have set an `InP-based membrane photonic integrated circuit' on a Si substrate using adhesive bonding and demonstrated low-energy digital transmission in the membrane.