利用多层基板夹层增强带宽的圆形MPA的设计与分析

2017 International Conference on Information Communication and Embedded Systems (ICICES) Pub Date : 2017-02-01 DOI:10.1109/ICICES.2017.8070774

G. Manjunath, Naseeruddin, K. M. Sadyojatha

{"title":"利用多层基板夹层增强带宽的圆形MPA的设计与分析","authors":"G. Manjunath, Naseeruddin, K. M. Sadyojatha","doi":"10.1109/ICICES.2017.8070774","DOIUrl":null,"url":null,"abstract":"In this paper, the design of circular microstrip patch antenna with sandwiching the substrates has been proposed for bandwidth enhancement. The proposed antenna is designed at 2.7GHz (S-band) using High Frequency Structural Simulator. The circular patch antenna is designed on two different substrates, FR4_epoxy and RT Duroid 5880™ and fabricated on the three layer FR4-epoxy substrate. The effect of dielectric constant, substrate stacking on the performance of an antenna system is compared and results from the simulator are analyzed. The result analysis shows that the bandwidth of this antenna has increased 2.5 times with three layer stacking at 10 dB return loss and directive gain of 4.7dBi. The work can be enhanced in the future using metamaterials to reduce the antenna weight and to increase the bandwidth of operation.","PeriodicalId":134931,"journal":{"name":"2017 International Conference on Information Communication and Embedded Systems (ICICES)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Design and analysis of circular MPA using multi-layer substrate sandwich for bandwidth enhancement\",\"authors\":\"G. Manjunath, Naseeruddin, K. M. Sadyojatha\",\"doi\":\"10.1109/ICICES.2017.8070774\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the design of circular microstrip patch antenna with sandwiching the substrates has been proposed for bandwidth enhancement. The proposed antenna is designed at 2.7GHz (S-band) using High Frequency Structural Simulator. The circular patch antenna is designed on two different substrates, FR4_epoxy and RT Duroid 5880™ and fabricated on the three layer FR4-epoxy substrate. The effect of dielectric constant, substrate stacking on the performance of an antenna system is compared and results from the simulator are analyzed. The result analysis shows that the bandwidth of this antenna has increased 2.5 times with three layer stacking at 10 dB return loss and directive gain of 4.7dBi. The work can be enhanced in the future using metamaterials to reduce the antenna weight and to increase the bandwidth of operation.\",\"PeriodicalId\":134931,\"journal\":{\"name\":\"2017 International Conference on Information Communication and Embedded Systems (ICICES)\",\"volume\":\"70 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 International Conference on Information Communication and Embedded Systems (ICICES)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICICES.2017.8070774\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 International Conference on Information Communication and Embedded Systems (ICICES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICES.2017.8070774","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

为了提高天线的带宽，本文提出了一种夹在基片上的圆形微带贴片天线。采用高频结构模拟器设计了2.7GHz (s波段)天线。圆形贴片天线设计在两种不同的基板上，FR4_epoxy和RT Duroid 5880™，并在三层fr4 -环氧基板上制造。比较了介电常数、衬底叠加对天线系统性能的影响，并对仿真结果进行了分析。结果分析表明，在回波损耗为10 dB、方向增益为4.7dBi的情况下，三层叠加后，该天线的带宽提高了2.5倍。未来可以使用超材料来减轻天线重量并增加操作带宽。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design and analysis of circular MPA using multi-layer substrate sandwich for bandwidth enhancement

In this paper, the design of circular microstrip patch antenna with sandwiching the substrates has been proposed for bandwidth enhancement. The proposed antenna is designed at 2.7GHz (S-band) using High Frequency Structural Simulator. The circular patch antenna is designed on two different substrates, FR4_epoxy and RT Duroid 5880™ and fabricated on the three layer FR4-epoxy substrate. The effect of dielectric constant, substrate stacking on the performance of an antenna system is compared and results from the simulator are analyzed. The result analysis shows that the bandwidth of this antenna has increased 2.5 times with three layer stacking at 10 dB return loss and directive gain of 4.7dBi. The work can be enhanced in the future using metamaterials to reduce the antenna weight and to increase the bandwidth of operation.

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来源期刊

2017 International Conference on Information Communication and Embedded Systems (ICICES)

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